Publications
Manuscript submission information.
- Manuscript submission for the special issue of the TCM2016 papers by the TSFs journal has been extended until 10th November.
- To submit your manuscript please click here.
(Authors must register in the “thin solid films web site” before they can proceed to manuscript submission)
- To ensure that all manuscripts are correctly identified for inclusion into the special issue, it is
important that you select “SI: TCM 2016” when you reach the “Article Type” step in the submission process.
- Submitted manuscripts should be 4 – 10 pages maximum including figures and references.
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All submitted papers (oral & poster) will be peer viewed and published in a special issue of Thin Solid Films after acceptance.
WARNING - If you think you already have an existing registration of any type (Author, Reviewer, or Editor) in this system, please DO NOT register again.
This will cause delays or prevent the processing of any review or manuscript you submit. If you are unsure if you are already registered.
Click the 'Forgotten Username/Password' button.
